Microsystems packaging specialists, who typically focus on one sub-specialty, will find this detailed exposition of the entire field broadening. Non-specialists with some general packaging knowledge will find here all that they need to fully understand and work with the key elements of microsystems packaging. Novices, students, and those in related technical fields will find a well-structured introduction that prepares them to deal with microsystems packaging.

This comprehensive textbook offers to all of the above groups a firm grounding in the diverse disciplines comprising microsystems packaging. Nineteen of the chapters share the title, "Fundamentals of ...". "Fundamental" means "a foundation," and that is what these chapters provide, covering the key elements of topics ranging from semiconductors to systems, including design, processing, materials, manufacture, testing, performance, reliability, thermal management, and environmental considerations.

For the specialist, who must build upon these foundations, each chapter includes a judicious selection of recommended further readings. For the autodidact, the scholar, or the flagellant, there are even homework problems to test your knowledge. Four chapters, covering optoelectronics, MEMS, RF packaging, and wafer-level packaging, lead the venturesome to the borders of today's knowledge, where they might glimpse the promised land, or just gape at the dark forests of ignorance.

Although the text is the child of fifty authors, the logical flow and smooth editing make it a unified work that speaks with one clear voice. Despite their diversity, the 2:1 ratio of academic to practitioner authors makes a good balance of technical rigor and practical experience. Talented illustrators provided a wealth of informative two-color pictures, charts, pictures, and diagrams.

In summary, despite my forty years in microelectronics research, engineering, management, and consulting, I learned new things every time I opened this book.