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|  | |  | | | Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) | | | | | SKU:
1_0815515138 | | In Stock | | Availability:
Usually ships in 1-2 business days | | Only 1 left in stock, order soon! | | | | | | This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references. | | | |
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| | Product Details | | Author: | James J. Licari | | Hardcover: | 475 pages | | Publisher: | William Andrew | | Publication Date: | December 17, 2007 | | Language: | English | | ISBN: | 0815515138 | | Product Width: | 157.0 centimeters | | Product Height: | 226.5 centimeters | | Product Weight: | 1.94 pounds | | Package Length: | 9.0 inches | | Package Width: | 6.1 inches | | Package Height: | 1.4 inches | | Package Weight: | 1.65 pounds | | Average Customer Rating: |  based on 2 reviews |
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| | Customer Reviews | Average Customer Review: ( 2 customer reviews )
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Most Helpful Customer Reviews
Industry guru shares the location of the secret elephant burial ground Oct 11, 2007
By Matt Swass
I thought I knew everything about adhesives for electronics, but this book covers everything and then some. A must have for industry professionals
Getting stuck with the right adhesives. Nov 01, 2005
By George Riley
"Adhesives Technology for Electronic Applications" is the first book dedicated exclusively to the electronic applications of adhesives. It leaves no need for another such book, at least until this generation gives way to nano or other adhesives. It is many books in one: textbook, handbook, reference book, catalog, history book. Together, all exhaustively cover the what, why, and how of electronics adhesives.
First, the history traces the development of adhesives for electronics assembly through four generations, beginning in the 1960's, revealing the problems encountered and solved as adhesive chemistry grew more sophisticated.
The textbook follows, providing the physics and chemistry foundations in a theory of how adhesives work. The four main functions of electronics adhesives, adhesion, electrical conductivity, heat transfer, and stress control, are examined sequentially. The chemistry chapter details the formulations and properties of eight major adhesive families used in electronics. For the chemically competent, this may be a well-structured refresher.
Past these textbook underpinnings, the handbook/catalog begins with the chapter on bonding manufacturing processes. This longest chapter (93 pages, 25 tables) follows the factory production flow, from pre-cleaning to final curing, and, alas, rework. Material, equipment, and processes are extensively covered, both with tables of generic information and examples of commercial products and their features, by supplier and model number.
The reference book takes a different useful viewpoint, examining all the major adhesive end-use applications. It illustrates how different requirements logically lead to different adhesive solutions. The message is clear: in the world of adhesives, one size doesn't fit all.
The concluding two chapters, on reliability and on testing, are a logical pair, sharing tables of specifications, test methods, and examples of test results. One useful table lists the sources for many government and commercial specifications and standards.
Overall, the book judiciously mixes clear explanations with extensive tabular information and more than 400 literature references. Having no index to the 76 tables is a minor annoyance. However, frequent users will no doubt bookmark their most-used tables
I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both.
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